Pattern resistance, heat generation, inductance, parasitic capacitance

This is a calculator for pattern resistance, pattern heat generation, pattern inductance and parasitic capacitance. Resistance and inductance (inductance) components are also generated in the copper foil pattern of the board. Patterns with large currents and high-speed signals where inductance is a concern should be treated with caution. Guidelines for copper foil thickness: 35um on the surface layer of a rigid board, 12um on the surface layer of a flexible board .